HR 100

Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering

Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs

No blowing away of neighbouring components

Optionally available with stand, 800 W IR bottom heating and PCB intake

Optional mit Stativ, 800 W IR-Untenheizung und Leiterplatten-Aufnahme

Vac Pen for safe handling of devices

Operation software IRSoft