HR 100

◾ Patented hybrid rework technology (combination of IR heating technology and convection) for safe desoldering and soldering

◾ Optimum energy transfer and gentle heating of chip components 0201 up to 20 x 20 mm SMDs

◾ No blowing away of neighbouring components

◾ Optionally available with stand, 800 W IR bottom heating and PCB intake

◾ Optional mit Stativ, 800 W IR-Untenheizung und Leiterplatten-Aufnahme

◾ Vac Pen for safe handling of devices

◾ Operation software IRSoft